Scope:
The provision of materials analysis and failure analysis services, including SEM, TEM-EELS, EDS, FIB, Liquid Cell, SIMS, AFM, SRP, Alpha step, XRD, XPS, X-Ray, EMMI, EMMI-InGaAs, OBIRCH, C-AFM, SCM, FTIR, Nano Probe, 3D Optical Microscope, Scanning Acoustic Tomography, Optical Microscope, 3D X-Ray, TDR, Optical Profiler and IC Layout Imaging, Circuitry analysis, Auger, THEMOS, ESD/Latch-up and ESD Gun tests, Wire Bonding and IC Package. File Number: 20001845 ITL
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